Colfax CX8860g-X67B3 Server | NVIDIA HGX B300 8-GPU & 2x 6700P Gen Intel Xeon Scalable Processors
Colfax
Overview
CX8860g-X67B3 is a 8U rackmount AI server from Colfax International built around an NVIDIA HGX B300 8-GPU baseboard (2304GB total HBM3e, NVLink/NVSwitch interconnect) with dual Intel Xeon Scalable Processors. Colfax's published "Cost As Configured" figure covers the enclosure and the HGX baseboard; processors, memory and storage remain configurable options and are not included in the listed price.
Key Features
- NVIDIA HGX B300 8-GPU baseboard, 2304GB total HBM3e, NVLink and NVSwitch
- 8U rackmount enclosure
- Dual-socket Intel Xeon Scalable Processors
- 36kW redundant power
- Published price, no quote required
Ideal For
organisations training or serving frontier-scale models who need an 8-way B300 node and want a published price to budget against rather than a sales quote
Enclosure
• 8U • Dimension (W x H x D) 17.6" x 13.82" x 35.43" (447 x 351 x 900 mm)
CPU
• Socket E (2x LGA 4710) • 2x 6700P Gen Intel® Xeon® Scalable Processors • Supports CPU TDP up to 350W
Chipset
• System on Chip
Memory
• 32x DIMM sockets • DDR5 memory supported only • 8-channel memory architecture • Memory speed: - RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC) - MRDIMM: Up to 8000 MT/s
Expansion Slots
• PCIe Bridge Board - CPBG045 x 2 - 4x PCIe 5.0 x16 slots (FHHL) from PEX89048
Storage
• 8x 2.5" hot-swap Gen5 NVMe drive bays - NVMe from PEX89104 M.2 • 1x M.2 (2280/22110), PCIe Gen5 x4, from PCH • 1x M.2 (2280/22110), PCIe Gen5 x2, from PCH
Networking
Front (I/O board - CFPG540) • 2x 10Gb/s LAN (Intel® X710-AT2) • 1x 10/100/1000 Mbps management LAN Rear (MLAN board - CDB66) • 8 x 800 Gb/s OSFP InfiniBand XDR or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™ • 1x 10/100/1000 Mbps management LAN
Video
• Integrated in ASPEED AST2600 controller - 1x VGA port
Power Supply
• 12 x 3000W redundant PSUs • AC Input: - 115-127V~/ 14.2A, 50-60Hz - 200-220V~/ 15.8A, 50-60Hz - 220-240V~/ 14.9A, 50-60Hz • DC Output: - Max 1450W/ 115-127V~ +54V/ 26.6A +12Vsb/ 3A - Max 2900W/ 200-220V~ +54V/ 53.4A +12Vsb/ 3A - Max 3002.4W/ 220-240V~ or 240Vdc Input +54V/ 55.6A +12Vsb/ 3A • 80PLUS Titanium
Front I/O
I/O board - CFPG540 • 2x USB 3.2 Gen1 ports (Type-A) • 1x VGA port • 2x RJ45 ports • 1x MLAN port (default) • 1x Power button with LED • 1x ID button with LED • 1x NMI button • 1x Reset button • 1x Storage activity LED • 1x System status LED
Rear I/O
• 8 x OSFP ports MLAN board - CDB66 • 1x MLAN port
TPM
• 1x TPM header with SPI interface • Optional TPM2.0 kit
Prices may vary. Verify on vendor site.
Quick Specs
- Enclosure
- • 8U • Dimension (W x H x D) 17.6" x 13.82" x 35.43" (447 x 351 x 900 mm)
- CPU
- • Socket E (2x LGA 4710) • 2x 6700P Gen Intel® Xeon® Scalable Processors • Supports CPU TDP up to 350W
- Chipset
- • System on Chip
- Memory
- • 32x DIMM sockets • DDR5 memory supported only • 8-channel memory architecture • Memory speed: - RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC) - MRDIMM: Up to 8000 MT/s
- Expansion Slots
- • PCIe Bridge Board - CPBG045 x 2 - 4x PCIe 5.0 x16 slots (FHHL) from PEX89048
- Storage
- • 8x 2.5" hot-swap Gen5 NVMe drive bays - NVMe from PEX89104 M.2 • 1x M.2 (2280/22110), PCIe Gen5 x4, from PCH • 1x M.2 (2280/22110), PCIe Gen5 x2, from PCH