Colfax CX8860s-X6B3 Server | NVIDIA HGX B300 8-GPU & 2x Intel Xeon 6700 Series Processors
Colfax
Overview
CX8860s-X6B3 is a 8U rackmount AI server from Colfax International built around an NVIDIA HGX B300 8-GPU baseboard (2304GB total HBM3e, NVLink/NVSwitch interconnect) with dual Intel Xeon 6700 Series Processors. Colfax's published "Cost As Configured" figure covers the enclosure and the HGX baseboard; processors, memory and storage remain configurable options and are not included in the listed price.
Key Features
- NVIDIA HGX B300 8-GPU baseboard, 2304GB total HBM3e, NVLink and NVSwitch
- 8U rackmount enclosure
- Dual-socket Intel Xeon 6700 Series Processors
- 40kW redundant power
- Published price, no quote required
Ideal For
organisations training or serving frontier-scale models who need an 8-way B300 node and want a published price to budget against rather than a sales quote
Enclosure
• 8U • Dimension (W x H x D) 17.6" x 13.8" x 37.4" (449 x 356 x 950 mm)
CPU
• Socket E2 (2x LGA 4710) • 2x Intel® Xeon® 6700 Series Processors • Supports CPU TDP up to 350W
Memory
• 32x DIMM sockets • DDR5 memory supported only • 8-channel memory architecture
Expansion Slots
• 2x PCIe 5.0 x16 slots (FHHL)
Storage
• 8x front hot-swap E1.S NVMe Drive Bays M.2 • 2x M.2 NVMe Slots
Networking
Front (I/O board) • 2x 10Gb/s LAN (Intel® X710-AT2) • 1x 10/100/1000 Mbps management LAN
Video
- 1x VGA port - 1x mini-DP port
Power Supply
• 6x 6600W redundant PSUs • 80PLUS Titanium
Front I/O
I/O board • 1x USB 3.0 port (Type-A) • 1x USB 2.0 port (Type-A) • 1x VGA port • 1x mini-DP port • 2x RJ45 ports • 1x MLAN port (default) • 1x Power button • 1x UID button LED • HDD activity • LAN1 activity • LAN2 activity • Power Fail • Power status • System information (overheat/UID)
TPM
• 1x TPM header with SPI interface • Optional TPM2.0 kit
Server Management
- SuperCloud Composer® - Server Manager (SSM) - Diagnostics Offline (SDO) - Supermicro Thin-Agent Service (TAS) - SuperServer Automation Assistant (SAA)
Prices may vary. Verify on vendor site.
Quick Specs
- Enclosure
- • 8U • Dimension (W x H x D) 17.6" x 13.8" x 37.4" (449 x 356 x 950 mm)
- CPU
- • Socket E2 (2x LGA 4710) • 2x Intel® Xeon® 6700 Series Processors • Supports CPU TDP up to 350W
- Memory
- • 32x DIMM sockets • DDR5 memory supported only • 8-channel memory architecture
- Expansion Slots
- • 2x PCIe 5.0 x16 slots (FHHL)
- Storage
- • 8x front hot-swap E1.S NVMe Drive Bays M.2 • 2x M.2 NVMe Slots
- Networking
- Front (I/O board) • 2x 10Gb/s LAN (Intel® X710-AT2) • 1x 10/100/1000 Mbps management LAN